You are biding on a 12" bumped Tungsten Microchip Patterned Wafer 

  Tungsten Characterization with TEOS or Black Diamond Low-k ILD on the single crystal silicon wafer.

·      It has been optically polished till ILD layer

·       Beautiful tungsten microchip pattern structure

·       Nice looking light copper/reddish color background 

·       The original value of bumped wafer is above $1000

·       Great to be used as gift, display object, exhibition, educating demonstration, testing, decoration or your collection.

·       No guarantee for research and other applications