ME-PB-103RAWD 3"x2 wireless circuit prototype PCB board

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In the past tens of years, I experienced so many difficulties when I worked on circuit prototyping. I am sure, you can understand me well since we are walking in the same way. Before checking the board specification, please allow me to ask you some questions. Then I am pretty confident, you are going to know the whole purpose of MeasureExplorer design of prototype board.

Actually all my thinking about circuit prototyping process is for a system relatively larger, which means usually it is hard to combine all the components onto a single board. However, on the other hand, it is always easier if you divide your whole system circuit into small parts. No matter your prototyping is for design testing or just build one for your special use, dividing your system into small functional module is helpful for your building and testing. And further, your own functional modules are useful for your future experiment. You can just take it form your hardware file to use without repeating the soldering again. Here is my first question. Have you ever had difficulty on mechanical coupling of your different functional module boards, in order to get stable, reliable electrical connection, and make the system fit into your special space?

Of course, you might be skilled on soldering, however, do you think it is difficult to sold more than 2 wires together at a point on your board? This is my second question, you can find a solution from MeasureExplorer prototype board products.

People give prototype board another name, bread board, which means that a lot of connection wires jumping across the board, finally building a thing like a bread. In fact, these jumping wires are so bad for signal transfering and are very easy to pick up noise, generate electrical and magnetic interference. So my third question is that have you ever had a dream making your prototype board like a real PCB, but without expensive cost and a lot of time on CAD design and waiting for the coming of your ordering?

When you do ultra high impedance circuit prototyping, base material of board, like FR4, is not a ideal insulator. Current leaking of board material can cause you losing the high impedance advantage of the IC you want to use. Here is a question for you. Do you know how to deal with ultra high impedance circuit in your prototyping process?

Surface mount components are widely used in current electronics design. I am sure you do not want to take a corresponding DIP part as your target in your experiment, in fact, some components have no corresponding DIP package for you choose at all. The question here is Do you get used to have a surface mount adapter in your prototyping?


These are what MeasureExplorer is trying to solve.